While the demand for high value-added automotive semiconductors is increasing due to the rapid growth of technologies related to electric vehicles, a device for processing the core parts of automotive semiconductors by using laser-waterjet micro process machine has been developed for the first time in the country.
The research team led by Principal Researcher Sanghoon Ahn of the Department of Laser and Electron Beam Technologies of the Korea Institute of Machinery and Materials (President Sang-jin Park, hereinafter referred to as KIMM), an institute under the jurisdiction of the Ministry of Science and ICT, announced that it has succeeded in developing a laser-*waterjet machine capable of processing high-strength materials that are difficult to process.
* This is a machine used for precisely processing various materials by ejecting high-pressure water.
Automotive semiconductors are core parts that control electronic equipment and engines. Electric vehicles or autonomous driving cars require more electronic equipment compared with conventional internal combustion engine vehicles, which means that they need a larger number of semiconductors. Using the newly developed laser-waterjet machine, it is possible to cut SiC* more conveniently. SiC has been gaining attention as an automotive semiconductor substrate, but the processing of SiC has relied on imported processing machines because the hardness of the material makes it difficult to process.
* SiC (silicon carbide) is a state-of-the-art semiconductor material. Due to its elevated-temperature stability and excellent electro-conductivity, SiC provides better functionality than silicon.
For the first time in Korea, the research team has succeeded in developing a 200W green nanosecond laser which has so far relied on imports, and has also developed a stable optical system capable of precisely maintaining the laser focal spot for nine times longer than conventional optical systems.
Additionally, the research team has designed the device in a way that makes it possible to forma laminar flow of more than 50 millimeters within the processing device through the waterjet nozzle. Then the laser beam is focused into the laminar flow, and it causes total reflection of beam inside a waterjet stream. The process can be performed at both edge and end of waterjet stream.
In the case of conventional laser processing devices, nanosecond laser processing systems is known as fast processing one, but it is difficult to achieve a precise result. Meanwhile, whereas ultrafast laser processing devices is known as precise processing, but the processing speed thereof is relatively slow.
The newly developed laser-waterjet machine is capable of processing materials fast and precisely. Moreover, the fine dust and smoke that are occurred during a laser processing can be collected by the waterjet, which helps to maintain a clean work environment. Another advantage of the newly developed machine is that it is cheaper by 20 percent compared with imported machines.
Principal Researcher Sanghoon Ahn of KIMM was quoted as saying, “We are very pleased to be helping to strengthen the technological competitiveness of Korea’s future semiconductor equipment industry by developing the laser waterjet machine for the first time in the country. Through the latest development, we will help to reinforce the competitiveness of the semiconductor industry and will also support Korean corporations’ efforts to expand their market share.”
Meanwhile, this research study was implemented with the support of the Ministry of Trade, Industry and Energy’s project regarding “Development of laser hybrid machine for machining of difficult to cut materials.”
